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Monday, April 18, 2011

Job Advert for Micro Electronics packaging process engineer

I am looking for a Process engineer with the requirments below, if interested please email me on:


T: +44(0)1506 403 550



Process Engineer Job Outline.

Degree or HND with relevant experience.

5 years industrial experience in the development/manufacturing of microelectronic or optoelectronic products.

Relevant experience in the any of wafer saw, wirebond, pick and place and precision placement equipment.

Familiarity with Telcordia, Jedec and IPC reliability requirements for optoelectronic, and semiconductor products/packages.

Knowledge of assembly processes for optical components such as LEDs, laser diodes and photo detectors including optical alignment would be an advantage Proven ability to manage technical projects to successful completion.


General Experience of working with external customers.

Used to working in small multi-skilled teams.

Good communication skills.

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